Laser plating technology is an emerging high-energy beam current plating technology, which is of great significance for the production and repair of microelectronic devices and large-scale integrated circuits. At present, although the principles of laser plating, laser ablation, plasma laser deposition and laser pointer spraying are still under study, its technology has been initially applied.
In the 1980s, a new technology of laser jet enhanced electroplating was developed, which combined the laser enhanced electroplating technology with the electroplating solution spray, so that the laser and the plating solution were simultaneously shot toward the cathode surface, and the speed of the transfer medium was much faster than the laser irradiation. The mass transfer rate caused by the microscopic agitation, thus achieving a very high deposition rate.
When a continuous laser or pulsed laser is irradiated on the surface of the cathode in the electroplating bath, not only can the metal deposition speed be greatly improved, but also the computer can control the movement trajectory of the laser beam to obtain the unshielded coating with the expected complex geometry. red laser pointer electroplating is a typical combination of classical technology and modern technology, is a new high-energy beam electroplating technology.
The use of laser technology can increase the metal deposition speed and increase the efficiency by 1,000 times. When a continuous laser or pulse laser is irradiated on the cathode surface in the electroplating bath, not only the deposition speed is increased, but also the computer can control the laser beam’s trajectory. Obtain the expected unshielded coating of complex geometry.