On March 14-16, Asia ’s largest laser pointers, optical and optoelectronic industry event “Munich Shanghai Expo Shanghai 2018”, many robot companies and top laser and optoelectronic technology brand manufacturers fully demonstrated lasers and photoelectronics , Optics and Optical Manufacturing, Laser Production and Processing Technology, Imaging and Machine Vision
Laser drive equipment continues to make breakthroughs, giving new vitality to the production line. At the Shanghai Optical Expo in Munich, as a supplier of semiconductor laser pointer stability and aging test equipment, based on the development trend of semiconductor lasers in the past few years, ILX has continued to innovate traditional laser technologies, giving new life to laser product lines . Based on the previous Sentry series, ILX has developed new products such as probe card series fixtures, characteristic station independent test systems, and carrier series fixtures.
ILX pushes probe card series fixtures to continuously break through the bottleneck of the industry. As a market and technology leader in high performance test and measurement solutions for laser diodes and other optoelectronic components. The main products are optoelectronic instruments, including laser diode controllers and drivers, temperature controllers, current sources, optical power and wavelength meters, semiconductor laser / LED aging test and characterization systems, and fiber optic sources. Products are currently sold around the world, including Fortune 500 companies, national research laboratories, governments and educational institutions.
Laser pointer drive equipment is constantly making breakthroughs to give the production line a new vitality. The new product introduced at the Shanghai Optical Expo has doubled the highlights. In addition to retaining the excellent performance of the previous system, it is also suitable for smaller packages and increased spectrum measurement. In addition, the carrier fixture can effectively reduce the number of times the chip is loaded, and the two sections of bonding and burn in are connected in series to reduce chip damage and improve production efficiency.