With the development of semiconductor laser chip technology and integrated technology, the power of high-power semiconductor lasers is getting higher and higher, and the laser pointer beam quality has also improved year by year. The power of high-power semiconductor lasers currently used in laser manufacturing can reach 6000W or higher. The light beam can be coupled into a fiber with a core diameter of 0.6mm, and the 1000W beam can be coupled into a fiber with a core diameter of 0.3mm. Therefore, high-power semiconductor lasers will be used as direct energy sources in materials processing fields that require high power density.
A typical semiconductor laser system has the following characteristics:
1) The laser wavelength is short, generally between 8xxnm-9xxnm
2) The beam energy distribution is flat-topped, and the energy distribution is more uniform
3) Different spot shapes can be obtained through different external light paths
4) Slightly lower energy density than fiber lasers
The 1000W-3000W high-power fiber-coupled semiconductor laser system provided by Optoelectronics has a wavelength of 915nm / 940nm / 976nm and 300μm / 400μm / 600μm fiber output. It is used in laser heat treatment, laser cladding, and green laser pointer metal welding. Its shorter wavelength is more suitable for metal absorption, higher output power, higher energy density, and uniform optical distribution of optical characteristics suitable for non-deep processing of metal surfaces. The laser is transmitted through the optical fiber, which is more flexible than the space output type and easy to integrate.