Application of ultrafast laser to brittle materials

Wang bo first introduced the characteristics of traditional long pulse laser and ultrashort pulse laser. As for the processing characteristics of ultra-fast laser, wang bo said, “ultra-fast laser pointer can focus on ultra-fine space, with extremely high peak power and very short laser pulse, and the processing process will not affect the surrounding materials in the space involved, thus achieving ultra-fine processing. Picosecond lasers provide higher peak power, higher repetition frequency and better beam quality, making them ideal for fine machining.”

Ultra-fast laser can be used in cutting, drilling and trenching of glass, ceramic, sapphire and other brittle materials, with small edge breakage, no taper, high efficiency and high surface finish. In addition, it can also realize the removal of ink and PVD on the surface of materials and the multi-focus and long-focus invisible cutting of transparent materials.

At last, wang bo introduced the application of ultra-fast laser in 3C electronics and combed the application of ultra-fast laser processing equipment. As for femtosecond lasers, which are faster in ultrafast lasers, wang said: “there is no melting zone, no recasting layer, and no microcracks in the tissue processed by femtosecond lasers. It is not restricted by the diffraction limit of light and has high spatial resolution. There is no selection and restriction of materials, and any materials can be fine processed, repaired and processed. The required pulse energy threshold is very low, generally only millijoule, which determines the low consumption of processing energy; The process does not produce shock waves that cause structural damage, and does not damage critical structural tissue.” The laser cutting machine for glass cover plate is used to replace the traditional CNC technology, which has greatly improved the processing effect and processing rate. At the same time, it has the advantages of energy saving, environmental protection and cost.