The principle of laser cutting is to use electronic discharge as a source of energy, use He, N2, CO2 and other mixed gases as the excitation medium, and use a mirror group to focus and generate a laser beam to cut the material. Those who often use 3C products are not difficult to find. Both mobile phones and computers have been developing in the direction of lightness and thinness. Electronic products have been upgraded in the direction of high integration and high precision. The internal components of their products have become more and more compact and precise. The degree of electronic integration is getting higher and higher, and the requirements of laser pointer welding technology for internal structural parts are getting higher and higher.
Laser beam belongs to non-contact processing, with small thermal influence, small processing area, and flexible methods. In the current production process of high-end digital mobile phones and digital product equipment, laser welding technology plays a significant role in product volume optimization and quality improvement. It makes the product lighter, slimmer and more stable, so it is more widely used.
Nowadays, with the continuous advancement of green laser pointer technology, global innovative electronic consumer products are changing with each passing day. Not only are the appearances dazzling and colorful, but integrated new technologies are endless. The changes in the electronics industry “Chaohui Xiyin, thousands of weather” have brought huge challenges to the laser equipment manufacturing industry. To this end, a series of laser processing equipment have been introduced to complete some “impossible” tasks in the electronics industry, which are manifested in multi-functionality in one machine, whether it is thickened hard board materials or soft-hard combined board materials or soft board materials. Can be done in one machine; cost-effective, higher than you think.