Coherent company launched a new high – power ultraviolet laser subsystem

The new laser cutting subsystem from coherent combines high power, ultraviolet (UV) lasers and precision scanning optical systems to provide fast throughput and excellent cutting quality for wafer, SIP and PCB processing.

Specifically, the PowerLine AVIA NX lasaer pointer cutting subsystem comes with a 40 W coherent AVIA laser source, a biaxial galvanometer deflector, a beam expander, and an f-theta scanning lens (large enough to cover a 300 mm wafer or PCB). This configuration produces a small focusing spot size on the working surface, with extremely high position accuracy and stability, allowing for fine features and narrow zone cutting with minimal heat affected zone (HAZ).

At the same time, the PowerLine AVIA NX offers unparalleled stability and longevity. The AVIA NX laser leverages coherent’s extensive expertise in building high power ultraviolet lasers to deliver exceptional service life.

In the PowerLine subsystem, the laser and other system components are housed in a sealed enclosure that utilizes filtered recirculated air to minimize external pollution sources. When maintenance is required, most operations can be performed on site without returning the equipment to the factory. The modular design simplifies this maintenance process by removing any component of the subsystem for maintenance or replacement without affecting the rest of the system.

PowerLine AVIA NX is a class IV laser subsystem designed for easy integration with system builders. In addition, coherent company can also provide extensive application support for pre-sale principle verification test and process formulation development. Once in use, all system parameters can be easily adjusted to apply to a specific task.