For single-layer suspended graphene, this value of visible light can be accurate to 2.3%. In addition, the graphene on the substrate can provide up to 10 times the light absorption according to the nature and interface of the substrate. When using an ultrafast laser pointer with a very high photon density, light absorption can be further improved. In this way, more accurate and efficient graphene ablation can be provided.
Ultrafast lasers are used for the chemical and physical processing of graphene. Electronic applications often require graphene to be placed on thermally grown silicon oxide on a silicon substrate. In this case, the high-efficiency absorption characteristics of graphene can achieve non-destructive ablation of graphene with silicon or silicon oxide.
Ultrafast lasers are used for the chemical and physical processing of graphene. Due to the atomic thickness of graphene, the processing time can be reduced by a single ablation method. Furthermore, devices with a size of 1 μm or smaller can be realized, and sub-wavelength resolution can also be achieved by laser-induced multiphoton processing.
Photochemical treatment of graphene. The photochemical treatment of the material surface is well known. It uses light irradiation (usually ultraviolet light) to change the properties of the material through internal phase changes or chemical reactions with the surrounding environment (gas, vapor, liquid, etc.).
The most widely used laser pointer photochemical processing method in green laser pointer processing is the additive manufacturing process of multiphoton polymerization through laser irradiation. This provides a unique process for the 3D chemical processing of polymers and composites. This method is also applicable to carbon-based graphene, which can be chemically processed by intense ultraviolet light oxidation. Other new characteristics of graphene are being studied, which can provide a scalable, fast, and repeatable impurity-free technology for graphene integration on a new microelectronic platform by using laser processing.