The development of any advanced technology is phased. For lasers, technology continues to develop. The first aspect is the laser pointer light source. The development of the laser light source has enabled many functions that were previously unexpected to be effectively realized. The development of the light source The first is that the wavelength is shorter, and the second is that the pulse width is narrower and the peak power is ultra-high. Now picoseconds and non-laser industrial products have been widely used, so that many technologies can be well realized. Picosecond and non-second ultra-short pulses can form ultra-high peak powers of hundreds of megawatts. What other material processing can not be achieved? The process of laser and material interaction can be seen through the application of ultrafast lasers. .
Ultra-fast processing is cold processing in the true sense. During the real processing, there is indeed no chipping and no heat conduction. From the actual silicon wafer processing diagram, you can also see the actual processing efficiency. Therefore, the ultra-fast technology application, especially at this stage, has brought revolutionary changes to the processing of our hard and brittle materials.
The application of laser in hard and brittle materials. For the actual application of laser in hard and brittle materials, our technology has the ability to achieve marketization, especially from the upper right corner. In fact, it is not only capable of making various forms Hole, after making the hole, directly use the laser to guide the edge. The hole making is relatively simple, but the technology based on it is different. Through different technologies, it can be realized in hard and brittle materials, whether it is thick or thin. Good results, especially with the expanding application of hard and brittle materials such as glass and sapphire on mobile phone panels, the most sensitive problem is the problem of the handset. It is necessary to make very small holes in the glass, which is simple to say, but It is very difficult to achieve during the production process.
Slotting of hard and brittle materials. Now wearable devices need to be waterproof. Therefore, when doing it, a slot is made around the hard and brittle material and then a gasket is added to the final package. At this stage, only green laser pointer can be very effective and it is already in the product. Widely promoted and applied. At this stage, with the development of ultra-fast technology, it has transitioned from the original Xiaolong cutting technology to the hot and cold hard split technology. At this stage, the laser filament forming technology can form very deep The laser focuses the spot, which will bring revolutionary seriousness in the processing of materials, whether it is sapphire or glass processing. If this technology is really applied to the processing, we don’t need to get the cleaning process at all. This is a very obvious change.
It seems that laser has such a technology. In fact, we have accumulated and developed this technology for more than five years. We have followed up and made this technology very early. At this stage, we are cutting and drilling hard and brittle materials based on laser technology. Among the technologies, we are the world leader. Lasers can even be molded in 3D. At this stage, it is 2.5D molding. 2.5D molding requires a surface roughness of 500 nanometers, which can be further improved with the development of technology.
Since laser technology has reached such an advanced technology in mobile phone applications, there are many aspects of OLED that can be used well. Under the development trend of OLED, this is very clear in the industry. The support of OLED involves many laser processing technologies. , The most direct thing here is laser glass, which is also the OLED production line. If the original production line is transformed, laser glass is one of the better solutions. This is the reason for this.